随着电子设备高频化的发展趋势,尤其在无线网络、卫星通讯、光纤通信、高速数据网络的日益发展下,为满足高频高速信号的传输性能要求，运用于高频印制电路板的需求量不断增加。

      为适应市场发展需求，我司通过技术攻关以及引进国内外先进的生产和检测设备，成功的开发出高频印制板，已具备2-30层批量加工能力。

      该产品已广泛应用于5G通信基站(天线、功率放大器、低噪音放大器、滤波器等)、汽车辅助系统（24GHz、77GHz毫米波汽车雷达）、航天技术、卫星通讯、军用雷达等高频通信领域

With the development trend of high frequency of electronic equipment, especially with the increasing development of wireless network, satellite communication, optical fiber communication, and high-speed data network, in order to meet the transmission performance requirements of high-frequency and high-speed signals, it is used in high-frequency printed circuit boards. Demand keeps increasing.

    In order to meet the needs of market development, our company has successfully developed high-frequency printed boards through technical research and the introduction of advanced production and testing equipment at home and abroad, and has the ability to process 2-30 layers in batches.

    This product has been widely used in 5G communication base stations (antennas, power amplifiers, low noise amplifiers, filters, etc.), automotive auxiliary systems (24GHz, 77GHz millimeter wave automotive radar), aerospace technology, satellite communications, military radar and other high-frequency communication fields